| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a BGA device in which no solder adheres to the contact of a BGA socket at the inspection of the BGA device, and the solder ball is not deformed. SOLUTION: Solder balls 5 are fixed on the underside of a package through metal members 6 in such a way that contacts 12 of a BGA socket 9 are not brought into contact with the solder balls, but brought into contact with the metal members 6 at the inspection. Accordingly, solder of the solder balls 5 do not adhere to the contacts of the BGA socket 9, and the solder balls 5 are not deformed.</p> |
