PRESSURE CONNECTION SUBSTRATE, LIQUID CRYSTAL DEVICE AND ELECTRONIC APPARATUS

摘要

PROBLEM TO BE SOLVED: To stabilize pressure connection structure by forming a step compensation pattern of substantially the same thickness as a wiring pattern at a position corresponding to the rear side of a substrate side terminal on the side opposite to the pressure side surface. SOLUTION: The pressure connection structure 33 has a rear surface wiring pattern 38 formed on the side 33b opposite to the pressure side surface 33a and passing through the rear side position of a substrate side terminal 34 on the pressure side surface 33a. Furthermore, a step compensation pattern 37 is formed at a position corresponding to the rear side of the substrate side terminal 34 on the side opposite to the pressure side substrate 33 where the rear surface wiring pattern 38 is not present. The step compensation pattern 37 is formed simultaneously with the rear surface wiring pattern 38 or independently therefrom thus obtaining a pressure connection structure stably.