| 摘要 |
<p>PROBLEM TO BE SOLVED: To pick up a silicon wafer fixed on a pedestal after the wafer is worked by sandblasting, without damaging the workability and work environment and in addition, to recover the pedestal after picking up the wafer without damaging the workability and work environment. SOLUTION: In a method for treating silicon wafer, a silicon wafer 11 fixed on a pedestal 12 is picked up, after the wafer is worked to a prescribed pattern by sandblasting. At fixing the wafer 11 on the pedestal 12, a double-coated adhesive sheet 10 is used as a means for fixing the wafer 11 on the pedestal 12 and is removed from the pedestal 12, after the wafer 11 is picked up.</p> |
