发明名称 WAFER ALIGNING APPARATUS
摘要 <p>PROBLEM TO BE SOLVED: To allow orientation of a wafer to be detected while maintaining its peripheral end or backside periphery. SOLUTION: A control means CTL is provided for controlling, such that when a wafer 3 is carried into a sensor unit 6, a wafer position detecting sensor 4 detects the wafer position, a wafer 3' is held with a roller 7 provided at the top end of a shaft 8, the shaft 8 is rotated by a bevel gear 9 to cause the wafer alone to rotate horizontally, a V-notch detecting sensor 5 detects the wafer peripheral end to calculate the wafer orientation. This allows the wafer 3 to be rotated with its back side periphery or peripheral end held in which no circuit is formed and enables detection of the center position or orientation of the wafer 3.</p>
申请公布号 JP2000332084(A) 申请公布日期 2000.11.30
申请号 JP19990138765 申请日期 1999.05.19
申请人 HITACHI TECHNO ENG CO LTD 发明人 KISHIMURA TOSHIHARU;IMAI YASUHIKO
分类号 H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/68
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