| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a mounting method of electronic part by filling the gap between a substrate and a CSP(chip size package) connected through solder bumps with an under fill material in which the manufacturing cost required for filling/curning the under fill material is reduced while preventing thermal deterioration of other parts. SOLUTION: A CSP 2 having solder bumps 1 formed on one side is mounted on the electrode part 3a of a printed wiring board 3 through the solder bumps 1. The gap between the CSP 2 and the board 3 is then filled with an under fill material 4, composed of a liquid thermosetting resin having a curing point not lower than the melting point of the solder bump 1, at a temperature lower than the melting point of the solder bump 1. Subsequently, it is heated up at a temperature of the melting point of the solder bump 1 or above and the solder bumps 1 are fused and bonded to the electrode part 3a while curing the under fill material 4.</p> |
