METHOD AND APPARATUS FOR FORMING IN-LAID CAPACITOR ON SEMICONDUCTOR WAFER

摘要

PROBLEM TO BE SOLVED: To eliminate residues included within the cavity of a semiconductor wafer by conducting megasonic cleaning of semiconductor wafer and brush scrub after polishing the layers formed within a cavity and on the upper surface of the semiconductor wafer. SOLUTION: After chemical and mechanical polishing of the layers formed within a cavity and on the upper surface of semiconductor wafer with a chemical mechanical polisher 38 is conducted, the semiconductor wafer is introduced into a cleaning system 40 passing through the entrance for the purpose of megasonic cleaning. Thereafter, a semiconductor wafer is automatically transferred to a first bush scrub station 46 for the brush scrub. Thereafter, the wafer is then transferred to a second brush scrub station 48. The semiconductor wafer is transferred to a spin dry station from the station 50 from the station 48. After the wafer is dried the wafer is then taken out from the cleaning system 40.