发明名称 HEAT TREATMENT DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To prevent a substrate from being damaged by suppressing the electrostatic charge of the substrate when the substrate is sucked by a heat treatment plate, when the substrate is peeled from the heat treatment plate, or when the substrate is heat treated. SOLUTION: Four product substrates are finally obtained out of a glass substrate 27, and the glass substrate has four effective areas. A suction hole 22 for sucking the glass substrate is provided in an area not corresponding to the effective areas of the glass substrate 27 and its vicinity thereof out of a substrate placement surface of a cooling plate 23, for example, only in a center part of the substrate placement surface, and only the center part of the glass substrate 22 is sucked. A lift pin 41 is provided on the cooling plate 23 corresponding to the outside and the center of the effective areas of the glass substrate 22.</p>
申请公布号 JP2001001224(A) 申请公布日期 2001.01.09
申请号 JP19990169536 申请日期 1999.06.16
申请人 HIRATA CORP 发明人 HONDA TOSHIHISA
分类号 B23Q3/08;(IPC1-7):B23Q3/08 主分类号 B23Q3/08
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