| 摘要 |
PROBLEM TO BE SOLVED: To provide an optical and electrical wiring board where an optical wiring layer which is not affected by the rugged surface of an electrical wiring is formed on an electrical wiring board provided with an electrical wiring. SOLUTION: This manufacturing method comprises a first process where an optical wiring layer 5 with a core which serves as an optical wiring that transmits optical signals is formed on the flat surface of a first support board, a second process where the optical wiring layer is separated from the first support board and bonded to the flat surface of a second support board 6, a third process where a second adhesive agent 10 is applied on the surface of the board with the electrical wiring 8, a fourth process where the surface of the optical wiring layer bonded to the surface of the second support board is bonded to the second adhesive agent applied to the surface of the board with an electrical wiring, a fifth process where the second support board and the first adhesive agent are separated from the optical wiring layer, and a sixth process where pads and viaholes necessary for mounting optical parts and electrical parts are formed on the optical wiring layer. |
