| 摘要 |
PROBLEM TO BE SOLVED: To reduce a package area by electrically connecting first and second semiconductor chips to first and second outer leads and sealing them with a sealing member. SOLUTION: First and second outer lead groups 12 and 13 to be mounted on a package and a fixed lead 10a fixed on a frame 10 are disposed in an alternate and integral manner, and end surfaces of the frame 10 of package leads are exposed in gaps 10b. And then, first and second semiconductor chips 14 and 15 are respectively mounted on both surfaces of an island 11 of the lead frame. The semiconductor chips 14 and 15 are electrically connected to the first and second outer lead groups 12 and 13. The structure including the first and second outer lead groups 12 and 13 is sealed with resin 18 as a whole. |
