| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a wiring board which is formed of a material that contains copper and is low in resistance and high in thermal conductivity and where thermal vias which are large in diameter and arranged at a narrow interval can be formed at the same time when an insulating board is formed by sintering. SOLUTION: A wiring board is equipped with an insulating board formed of ceramic whose main component is aluminum oxide and relative density is 95% or above and which contains 2.0 to 10.0 wt.% Mn in terms of Mn2O3 and thermal vias 2 provided penetrating through the insulating board so as to dissipate heat released from a heat releasing device mounted on the insulating board, where the thermal via 2 is formed of thermal good conductor which contains 10 to 60 vol.% copper and 40 to 90 vol.% tungsten and/or molybdenum, its maximum diameter is set 200μm or above, and an interval between the adjacent thermal vias is set at 50 to 300μm. |
