| 摘要 |
PROBLEM TO BE SOLVED: To inhibit the remaining of bubbles mixed in conductive paste by filling the prescribed amount of conductive paste in the opening of a through hole formed in a resin insulating layer and pressing conductive paste with a vacuum condition. SOLUTION: A metallic layer 10 is formed on one surface of an insulating substrate 20, and a protection film 30 is stuck to a surface opposite to the surface where the metallic layer 10 is installed. Laser is irradiated from above the protection film 30 stuck onto the insulating substrate 20, and an opening for forming via hole 40 to the metallic layer 10 from the surface where the metallic layer 10 is not installed is formed. Then, a metal mask 42 is arranged on the opening 40, and conductive paste 44 is filled in the opening for forming via hole 40 through the opening of a metal mask 42. Conductive paste 44 is pressed by a pressing device under the vacuum condition. |
