| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a polishing apparatus and a polishing method wherein the scale of the apparatus can be reduced, the processing time is shortened, and substrates of high cleanliness can be provided by performing a cleaning step with a more simplified structure of the apparatus. SOLUTION: This polishing apparatus has a storage section for storing a substrate, a polishing section 10 for performing a first polishing step and a second polishing step of chemically mechanically polishing the substrate while supplying a polishing solution between the substrate and a polishing tool 13 and moving the substrate relative to the tool 13, a rotating cleaning section 26 for removing particles deposited on the substrate by scrubbing the substrate while supplying a cleaning solution to the substrate and further removing metallic ions on the substrate while supplying an etching solution, and a substrate transfer unit for transferring the substrate among these sections.</p> |
