| 摘要 |
PROBLEM TO BE SOLVED: To prevent a gap between a mold part and an assembly section from being formed by clamping the assembly section having a region being extended from the fitting surface of a semiconductor pressure pickup to the outside of a side part inside an injection mold. SOLUTION: A conductor frame with a semiconductor pressure pickup is inserted into an injection molding mold 40 that is composed of an upper part 41 and a lower part 42. A projection region 13 of an assembly section 12 of the conductor frame is clamped between an upper part 41 and a lower part 42 of the injection molding mold, thus the position detector of the assembly section 12 in the molding mold 40 is fixed. The lower part 42 of the mold in contact with a lower surface 15 of the assembly section 1 covers also a pressure passage 27. Then, the semiconductor pressure pickup is buried into a casing 30 made of a forming material by an injection molding method such as a force feeding forming. In this method, the forming material is liquefied in an injection mold chamber and then is forced into a mold closed under pressure to be cured in the mold. Then, the mold part is eliminated from the pressure sensor. |
