| 摘要 |
<p>PROBLEM TO BE SOLVED: To improve the reliability of a semiconductor device by preventing the island of a lead frame from being warped and to provide a lead frame and a semiconductor device which can prevent drop in quality and short- circuiting caused by break of a suspension lead. SOLUTION: A lead frame includes an island 11 for mounting a semiconductor chip, a plurality of leads 12 connected electrically to a semiconductor chip mounted on the island 11, and a frame 13 connecting the leads 12. The island 11 is independent of the frame 13 and is supported by a resin tape 16, in a state where it is connected to the frame 13. A semiconductor device is fabricated by cutting the resin tape 16 after the semiconductor chip is mounted on the island 11. Even if changes in the temperature caused accompanying resin forming is applied to the island 11 and the resin tape 16, since the thermal expansion/ contraction coefficient of the resin tape 16 is close to that of sealing resin as compared with a metal, stresses generated between the resin tape 16 and the sealing resin can be kept extremely small, thereby preventing the island 11 from being warped.</p> |
