| 摘要 |
PROBLEM TO BE SOLVED: To obtain a stem for semiconductor laser device by drawing a thin metal plate, and secure strength and heat radiation. SOLUTION: To form a stem in a semiconductor laser device with a thin metal plate, an annular wall portion is formed on a base 1 by press working of the thin metal plate. An out lead 4 is disposed in a space formed in this annular wall portion and fixed by filling and solidifying m insulating thermosetting resin. A mounting portion (heat sink) 3 for mounting a silicon submount on the base 1 is formed integrally with the base 1 by press working. Insufficient strength and heat radiation due a thin metal plate stem is compensated by formation of the continuous walls. |
