| 摘要 |
PROBLEM TO BE SOLVED: To develop an interlayer insulating adhesive for multilayer printed circuit board exhibiting flame retardancy without using a halogen or phosphorus and excellent in storage stability and heat resistance. SOLUTION: This interlayer insulating adhesive for multilayer printed circuit board comprises (1) a thermoplastic resin having sulfone group and 103-105 weight-average molecular weight, (2) an epoxy resin having >=25.0 oxygen index and <=500 epoxy equivalent, (3) a phenol novolak-type epoxy resin having <=1,000 weight-average molecular weight, (4) an epoxy resin curing agent and (5) an inorganic filler as essential components. |
