| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a substrate carrier container where sealability airtightness are improved, while compatible with a conventional substrate carrier container. SOLUTION: A substrate carrier container 1 houses a wafer cassette 5 in which a wafer 4 is placed, being provided with a container main body 2 and a bottom lid 3. A vacuum channel 6 for evacuation is provided in the sidewall of the container main body 2. For vacuum-sealing, an O-ring channel 3a and the vacuum channel 6 are evacuated through a exhaust valve 7 and a vacuum piping 16, for tight closure. When the bottom lid 3 is detached from the substrate carrier container 1, an inert gas is introduced into the vacuum channel 6 through an inert gas guide pipe 17 and a supply pipe 8. If no vacuum-sealing is required, one end of a latch 9 is engaged with a latch channel 2b by a latch operation part 10 for tight closure.</p> |
