| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed wiring board in which ensuing printing accuracy, ease of working of an insulating layer and reliability that are required for building up the printed wiring board, and simplification of a process are satisfied simultaneously. SOLUTION: Insulating resin sheets with copper foil on which a circuit conductor is formed are piled on the surface and backside of a laminated plate on which an internal layer circuit conductor is formed, and they are heated and pressurized so that the circuit conductor is pressed in to a resin surface of the insulating resin sheet with a copper foil for lamination and unifying into a body. The surface of the printed wiring board is planarized, so that the insulating layer built up on the surface thereof is also flat and even. Thereby a thin layer, out of which the circuit conductor will not be exposed, is formed. |
