| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for making a multilayer printed wiring board which is superior in formation accuracy of wiring. SOLUTION: An adhesive agent with a copper foil is adhered to an inner layer circuit board, and the copper foil of the adhered adhesive agent with the copper foil is completely etched, and then its entire surface is plated thinly with a copper. A laser is directed to the plated copper to form a via-hole reaching the inner circuit, and the board is desmeared and plated with a copper. Furthermore, its unnecessary copper plating is removed by etching to form an outer layer circuit, resulting in a multilayer printed wiring board. |
