发明名称 METHOD FOR ASSEMBLING REINFORCING ELEMENTS BY BONDING AND DEVICE OBTAINED BY SAID METHOD
摘要 <p>The invention concerns a method for assembling at least two elements (10, 20) having each a substantially planar assembling surface (12, 22), comprising the following steps: a) forming apertures (16, 26) in at least one of the elements (20); b) contacting the assembling surface of said element with the assembling surface of at least a second element (10) to bring about adherence; c) setting an adhesive (28) in said apertures such that the adhesive is in contact with a part of each of the elements. The invention is useful for making optical, mechanical or electronic components.</p>
申请公布号 WO2001032579(A1) 申请公布日期 2001.05.10
申请号 FR2000003055 申请日期 2000.11.02
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