| 摘要 |
PROBLEM TO BE SOLVED: To suppress the generation of a shear stress in connection terminals even in the case where a heat cycle is repeatedly applied and to enhance the reliability of the connection of a package for housing a semiconductor element with an external circuit board in the package for housing the semiconductor element of a structure, wherein the semiconductor element is flip-chip mounted on a metallized wiring layer and a high heat conductive cover body is mounted on the surface of the element. SOLUTION: For packaging a semiconductor element, the semiconductor element 2 provided with electrodes for connection is flip-chip mounted on a metallized wiring layer 3 on the surface of almost a quadrangle-shaped insulating substrate 1 formed by coating with the layer 3. A high heat conductive cover body a which is attached on the surface of the substrate 1 in such a way as to cover the element 2 and is provided with its one part bonded to the upper surface of the element 2, and a plurality of connection terminals 5 which are provide on the rear of the substrate 1 and comprise solders electrically connected with the element 2, are provided. The cover body 9 is formed into the form of almost a quadrangle, legs 11 are respectively provided on each side part of the form of almost the quadrangle, and the legs 11 are attached on the substrate 1. |
