| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer wiring board which can be easily designed, reduced in design cost, and kept high in characteristic uniformity independently of a designer. SOLUTION: The core board 3 of a multilayer wiring board 1 is equipped with continuity through-holes 5T in which a continuity through-hole conductor 6T electrically connected to both a main surface wiring 34 and a rear surface wiring 39 is formed respectively and furthermore provided with dummy through- holes 5F in which a dummy through-hole conductor 6F electrically insulated from the main surface wiring 34 and/or the rear surface wiring 39 is formed respectively. The through-holes 5 are arranged nearly like a lattice at a prescribed interval. |
