| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain the cooling device of a circuit module for reducing stress being applied to the connection part between an IC chip and a circuit board and at the same time allowing the heat of the IC chip from escaping to a heat sink efficiently. SOLUTION: The cooling device is provided with a heat sink 36 that is overlapped onto a semiconductor package 26. The heat sink is provided with a heat reception part 38 for receiving the heat of an IC chip 28 that is electrically connected to a circuit board 27 made of synthetic resin, and a flexible heat transfer member 41 such as grease and a heat transfer sheet is included between the heat reception part and the IC chip. The heat sink is pressed toward the IC chip via a fixing spring 44, thus thermally connecting the heat reception part and the IC chip via a heat transfer member. A spacer 50 for supporting the heat sink at a position deviating from the IC chip is included between the circuit board and the heat sink.</p> |
