| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor device improving the reliability of connection by reducing the failure of connection at the time of mounting, and stably making thin this device. SOLUTION: A solder bump 16b is formed to be connected with the circuit pattern of a semiconductor chip formed on a semiconductor wafer 10, and a probe needle is pressed to the solder bump 16b so that the electric characteristics of the circuit pattern can be inspected. Then, a protecting tape 17 is attached to the whole face of the solder bump 16b of the semiconductor wafer 10, the semiconductor wafer 10 is pressed from the upper part of the protecting tape 17 with a jig 18 having a flat surface so that the height of the solder 16b can be made uniform, and the adhesion of the protecting tape 17 to the semiconductor wafer 10 can be improved. Then, the semiconductor wafer 10 is made thin by a machine grinding method, a chemical machine grinding method, or etching method or the like from the face opposite to the attached face of the protecting tape 17.</p> |
