| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device constituted of three constituent members of a semiconductor component, wires and a sealing resin instead of a conventional semiconductor device having four constituent members of at least a semiconductor component, an inner lead part, wires and a sealing resin and to contrive a reduction in the thickness of the device. SOLUTION: This semiconductor device is a semiconductor device of a structure that the device comprises a semiconductor component 2, gold wires 4 with each one end connected with electrodes on the component 2, and a sealing resin 5 sealing the component 2 and the outer peripheries of the wires 4. The bottom of the component 2 and the other ends of the wires 4 are exposed from the resin 5 as external terminals, and ball-shaped external electrodes 6 are provided on the lower surface of the resin 5. The device is not a conventional device having an external connection structure using inner leads, but a semiconductor device having an external connection structure using the wires. By this constitution, the device is realized by three constituent members of the component 2, the wires 4 and the resin 3 without a lead frame and a miniaturization of the device, and a reduction in the thickness of the device can be achieved.</p> |
