发明名称 CONDUCTIVE CIRCUIT STRUCTURE
摘要 <p>PROBLEM TO BE SOLVED: To improve latitude for the position of a circuit conductor, which is arranged on a resin board and to which a counterpart circuit is connected. SOLUTION: Conductive circuit conductors 2 are arranged on the insulating resin board 1. Conductive surfaces 3 of the circuit conductors 2 are exposed continuously starting from the resin board in the longitudinal direction. Both sides 4 of the conductive surfaces are covered with brim walls 5 of the insulating board and fixed. Bus-bars or conductive resin materials are used as the circuit conductors 2. The bus-bars 2 are insert-molded in the resin board. The conductive resin materials are cast in grooves of the resin board and cured. Contact terminals of counterpart circuits, electrical components, etc., are brought into contact with the conductive surfaces of the circuit conductors 2. A 2nd circuit board is stacked on the resin board. Through-holes, through which the conductive surfaces of the circuit conductors 2 are exposed, are formed in the 2nd circuit board, and contact terminals are inserted into the through-holes. The contact terminals of the counterpart circuits, the electrical components, etc., are brought into contact with circuits of the 2nd circuit board.</p>
申请公布号 JP2001177951(A) 申请公布日期 2001.06.29
申请号 JP19990355511 申请日期 1999.12.15
申请人 YAZAKI CORP 发明人 WATABE HIROSHI
分类号 H01R4/58;H02G3/16;H02G5/00;H02G5/04;H05K1/02;H05K1/09;H05K1/14;H05K3/10;H05K3/20;H05K7/06;(IPC1-7):H02G3/16 主分类号 H01R4/58
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