| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a resin paste composition that can bond a semiconductor element to the supporter by curing within 20 seconds and can attain high bond strength, low chip warpage and low voids and provide semiconductor devices of high reliability in high productivity using the same. SOLUTION: This resin paste composition comprises (A) a reaction product between an acrylic or methacrylic ester bearing at least one carboxyl group and a compound bearing at least two epoxy groups in one molecule, (B) an acrylic ester or a methacrylic ester, (C) a radical initiator, (D) an epoxy resin, (E) an epoxy resin curing agent and (F) a filler. This resin paste composition is used to bond a semiconductor element to a supporter thereby producing the objective semiconductor device.</p> |
