WAFER LEVEL PACKAGE AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A wafer level package and a method for manufacturing the same are provided to simplify a package manufacturing process and reduce a manufacturing cost by performing a packaging process in a wafer state. CONSTITUTION: A sinking portion is formed on a center of a surface of a semiconductor wafer(10). A bond pad(12) is formed on a bottom face of the sinking portion. An insulating layer(20) is formed from an edge of the bottom face of the sinking portion to a surface of an edge of the semiconductor wafer(10). A metal pattern(30) is deposited on the insulating layer(20). An auxiliary junction layer(40) is deposited on the metal pattern(30) of the edge surface of the semiconductor wafer(10). A metal wire(50) connects the metal pattern(30) with the bond pad(12) electrically. An encapsulant(60) is buried into the sinking portion.