WAFER LEVEL PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A wafer level package is provided to prevent a crack occurring when stress is applied to a solder ball mounted in a board, by interposing an elastic tape between a semiconductor chip and a metal pattern to make the elastic tape absorb the stress. CONSTITUTION: A bonding pad(11) is formed on the surface of a semiconductor chip. An elastic tape(20) has an opening exposing the bonding pad, adhered to the surface of the semiconductor chip. A conductive layer(30) is deposited on the elastic tape. A metal pattern(31) is plated on the conductive layer by an electroplating method using electricity supplied through the conductive layer, having a ball land. An insulating layer(50) is applied on the elastic tape to expose the ball land of the metal pattern. A solder ball(60) is mounted in the ball land of the metal pattern exposed through the insulating layer.