发明名称 |
Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device |
摘要 |
A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing system including at least one polishing unit for polishing the workpiece, a washing system and a drying system at least including one washing unit for washing and drying the polished workpiece, and an unloading unit for receiving thereon a resultant clean and dry polished workpiece.
|
申请公布号 |
US2001014572(A1) |
申请公布日期 |
2001.08.16 |
申请号 |
US20010804233 |
申请日期 |
2001.03.13 |
申请人 |
|
发明人 |
OKUMURA KATSUYA;AOKI RIICHIROU;YAJIMA HIROMI;ISHIKAWA SEIJI;TSUJIMURA MANABU |
分类号 |
B08B1/04;B24B27/00;B24B37/04;B24B51/00;B24B55/12;F24F3/16;H01L21/00;H01L21/677;H03M13/39;H04L1/00;H04N5/44;H04N5/455;(IPC1-7):B24B1/00;B24B7/19 |
主分类号 |
B08B1/04 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|