COPPER CHEMICAL-MECHANICAL POLISHING PROCESS USING A FIXED ABRASIVE POLISHING PAD AND A COPPER LAYER CHEMICAL-MECHANICAL POLISHING SOLUTION SPECIFICALLY ADAPTED FOR CHEMICAL-MECHANICAL POLISHING WITH A FIXED ABRASIVE PAD,申请号KR1020017005873-传众专利搜索

发明名称	COPPER CHEMICAL-MECHANICAL POLISHING PROCESS USING A FIXED ABRASIVE POLISHING PAD AND A COPPER LAYER CHEMICAL-MECHANICAL POLISHING SOLUTION SPECIFICALLY ADAPTED FOR CHEMICAL-MECHANICAL POLISHING WITH A FIXED ABRASIVE PAD
摘要
申请公布号	KR20010080972(A)	申请公布日期	2001.08.25
申请号	KR1020017005873	申请日期	2001.05.10
申请人		发明人
分类号	H01L21/304	主分类号	H01L21/304
代理机构		代理人
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