| 摘要 |
A small-sized image pickup module which improves the construction in which the a mirror frame body is attached in such a manner as to contain an image pickup semiconductor device chip attached onto a base plate and which is easy to assemble while reducing cost. Such module according to one embodiment of the invention comprises a base plate of nonmetal including ceramic, an image pickup semiconductor device chip including a two-dimensional C-MOS image sensor, etc., attached onto the base plate, a spectacle frame body attached onto the base plate to contain the image pickup semiconductor device chip and having a diaphragm and lens fixing portion press-formed integrally therewith in the order mentioned as seen from the front end, and a lens attached to the lens fixing section of the spectacle frame body. |
