发明名称 |
SEMICONDUCTOR OPTICAL ELEMENT MOUNTING CARRIER, SEMICONDUCTOR OPTICAL ELEMENT MODULE AND ITS MANUFACTURING METHOD |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor optical element mounting carrier, a semiconductor optical element module and its manufacturing method which can surely prevent excessive solder from overflowing on the side of a semiconductor optical element to improve the yield and the workability of the semiconductor optical element module. SOLUTION: A trench 3 is formed into a part for mounting a semiconductor optical element 1 on a carrier 2 for mounting the semiconductor optical element and the semiconductor optical element 1 is soldered to the mounting part with the trench 3 formed therein to mount the element.</p> |
申请公布号 |
JP2001298237(A) |
申请公布日期 |
2001.10.26 |
申请号 |
JP20000112921 |
申请日期 |
2000.04.14 |
申请人 |
NIPPON TELEGR & TELEPH CORP <NTT> |
发明人 |
TSUZUKI TAKESHI;YOSHINO KAORU |
分类号 |
G02F1/015;H01L31/02;H01S5/022;(IPC1-7):H01S5/022 |
主分类号 |
G02F1/015 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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