发明名称 SEMICONDUCTOR OPTICAL ELEMENT MOUNTING CARRIER, SEMICONDUCTOR OPTICAL ELEMENT MODULE AND ITS MANUFACTURING METHOD
摘要 <p>PROBLEM TO BE SOLVED: To provide a semiconductor optical element mounting carrier, a semiconductor optical element module and its manufacturing method which can surely prevent excessive solder from overflowing on the side of a semiconductor optical element to improve the yield and the workability of the semiconductor optical element module. SOLUTION: A trench 3 is formed into a part for mounting a semiconductor optical element 1 on a carrier 2 for mounting the semiconductor optical element and the semiconductor optical element 1 is soldered to the mounting part with the trench 3 formed therein to mount the element.</p>
申请公布号 JP2001298237(A) 申请公布日期 2001.10.26
申请号 JP20000112921 申请日期 2000.04.14
申请人 NIPPON TELEGR & TELEPH CORP <NTT> 发明人 TSUZUKI TAKESHI;YOSHINO KAORU
分类号 G02F1/015;H01L31/02;H01S5/022;(IPC1-7):H01S5/022 主分类号 G02F1/015
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