| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a housing case which can cope with the recent high integration of semiconductor elements, and is inexpensive, and does not take labor and time, in view of prevention of adhesion of particles within a case to a product, in a case which stores a product such as photo masks or the like. SOLUTION: This is a case for housing thin plate form product 180 such as photomask, mask blank glass board, wafer, or the like. This is provided with an adhesive layer to cause dust to stick to the inside of the case, and the adhesive layer is a sticky resin layer 130.</p> |
