发明名称 STRATIFIED HEAT SINK DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To contrive the increase of cooling efficiency by allowing air current to reach the center part of a device being at the highest temperature to which the air current does not reach. SOLUTION: The inside of the device is divided into a suction layer L1 and a diffusion layer L2 by a partition wall 1 drilling a ventilating hole 4, the suction layer L1 and the diffusion layer L2 communicate with each other, outside air is sucked by the negative pressure of the air current W1 from a fan F to make air current W2 reaching the center part of the device, and after heat exchange, the air current W2 is made to flow to the diffusion layer L2 from the ventilating hole 4, and smoothly diffused to the outside as air current W3.</p>
申请公布号 JP2001308244(A) 申请公布日期 2001.11.02
申请号 JP20000125715 申请日期 2000.04.26
申请人 PMC:KK 发明人 SHIZU TAKESHI
分类号 G06F1/20;H01L23/36;H01L23/467;(IPC1-7):H01L23/467 主分类号 G06F1/20
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