Contact pad of a semiconductor device

摘要

The invention relates to a contact connector which forms an electrical contact between the wiring and the connecting wires on the semiconductor component. According to the invention, the contact connector has the advantage that, even when the second electrical conducting element is damaged during the bonding or the application of measuring needles, this does not lead to damage to the first electrical conducting element, due to the fact that the vertical projection of the bonding surface on the first insulation, in which the first electrical conducting element is embedded, is arranged next to the first electrical conducting element and thus the first electrical conducting element is not cut as the pressure of the measuring needles or the pressure occurring during the bonding process is taken by the first insulation.