| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for sealing a semiconductor, little in amount of added inorganic filler and excellent in fluidity because only a little amount of an added cyclic phosphazene compound is needed, and further having improved flame retardancy without using a bromine compound and an antimony compound, and excellent solder resistance. SOLUTION: This epoxy resin composition for sealing the semiconductor consists essentially of (A) an epoxy resin represented by general formula (1), (B) a phenol resin represented by general formula (2), (C) an inorganic filler, (D) a curing accelerator, and (E) the cyclic phosphazene compound represented by general formula (3).
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