| 摘要 |
Sol-gel-derived "0-3 composite" ceramics are provided for application to electronics components directly written onto low-temperature substrates. The 0-3 composite materials are prepared from a mixture of liquid-phase and solid-phase constituents, as are the pastes conventionally used to prepare thick-film materials for the electronics industry. The prepared 0-3 composites exhibit several advantages, including substantial reductions in (1) processing temperatures, (2) solvent concentrations, and (3) organic post-processing-residual concentrations. In addition, the rapid removal of solvent during application is compatible with such rapid prototyping methods as laser densification. The 0-3 composites may be deposited onto plastic substrates while still meeting expected performance standards. Therefore, the direct writing of electronics components onto such low-temperature substrates as plastic may be achieved using sol-gel-based 0-3 composites. The process is useful for resistors, capacitors, insulators, inductors and conductors.
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