| 摘要 |
<p>PROBLEM TO BE SOLVED: To increase the efficiency of a mounting process and reduce a manufacturing cost by simplifying the mounting process for mounting a semiconductor chip on a mounting substrate by a flip chip bonding method. SOLUTION: The method of mounting a semiconductor chip for mounting a semiconductor chip on the mounting substrate by a flip chip bonding method comprises a step of applying an adhesive for sealing a joint part between a bump of the semiconductor chip and a connection pad of the mounting substrate, when the semiconductor chip is bonded on the mounting substrate on a semiconductor chip mounting face of the mounting substrate; a step of mounting the semiconductor chip on the adhesive applied face of the mounting substrate by pressurizing the semiconductor chip after making an alignment between the bump and the connection pad; and a step of hardening the adhesive by a reflow process to seal a joint between the semiconductor chip and the mounting substrate to bond the chip and the substrate, and at the same time, to connect the bump and the connection pad.</p> |
