发明名称 METHOD OF MANUFACTURING LAMINATED CERAMIC ELECTRONIC COMPONENT, AND THE LAMINATED CERAMIC ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To obtain a laminated ceramic electronic component, with which external electrode formation process can be simplified markedly and which is superior in the reliability of electrical connection between inner electrodes and the external electrodes. SOLUTION: This method of manufacturing a laminated ceramic electronic component comprises a step of forming a composite sheet 22 having conductors 22B, 22C on a carrier film and a ceramic green sheet 22A formed around the conductors 22B, 22C, a step of laminating at least a plurality of the composite sheets 22 to obtain a mother laminate a step of cutting the mother laminate in the thickness direction, so as to divide the conductors 22B, 22C to obtain laminates of individual laminated ceramic electronic component units, in each of which the conductors 22B, 22C are exposed on the cut surfaces, and a step of sintering the laminates and simultaneously as the sintering of the ceramics, forming the external electrodes with the exposed conductors.
申请公布号 JP2001332424(A) 申请公布日期 2001.11.30
申请号 JP20000150204 申请日期 2000.05.22
申请人 MURATA MFG CO LTD 发明人 OKUYAMA SHINGO;NAKAGAWA TADAHIRO
分类号 H01G4/12;H01F17/00;H01F41/04;H01F41/10;H01G4/30;H03H3/00;H03H7/01;(IPC1-7):H01F17/00 主分类号 H01G4/12
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