| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which can be increased in both the connection reliability with electronic components mounted on a principal plane and the connection reliability with other substrates connected on a rear face, and also to provide a method of manufacturing the same. SOLUTION: The wiring board 1 is provided with a principal plane-side connection terminal to be soldered to connection terminals of an IC chip on a principal plane 1A, and a rear face-side connection terminal 41 to be mechanically brought into contact with connection terminals of a mother board on a rear face 1B. The principal plane-side connection terminal 33 includes, on the surface, a principal plane-side substitution Au plating layer 45 in the thickness of 0.03 to 0.12μm, and the rear face-side connection terminal 41 includes, on the surface, a rear face-side substitution Au plating layer 55 in the thickness of at least 0.2μm which is thicker than the principal plane-side one 45. |
