| 摘要 |
PROBLEM TO BE SOLVED: To make firmer the junctions of a substrate mounted with a semiconductor element on its upper surface to a frame and an input-output terminal and, at the same time, to efficiently radiate the heat generated when the semiconductor element is operated. SOLUTION: The substrate 1 having a mounting section 1d for mounting the semiconductor element 7 on its upper surface is composed of a molybdenum substrate 1c having a plurality of through holes 1b-a and copper sheets 1a, which are respectively bonded to the upper and lower surfaces of the substrate 1c with a brazing material 1b. The brazing material 1b enters the through holes 1b-a of the substrate 1c and covers almost all inner peripheral surfaces of the holes 1b-a. |
