| 摘要 |
PURPOSE: An intelligent power module using a chip-type power switching element is provided to reduce a manufacturing cost of IPM, and minimize size of the IPM by attaching a heat sink to a rear surface of the IPM. CONSTITUTION: A body includes a plurality of input terminals(111) and output terminals(113) on both side surfaces in length direction. A receiving part(115) receives a printed circuit board. A stepped portion(117) is formed to make the input terminals and the output terminals possible to be bonded by the printed circuit board and a wire(101). A coupling hole(119) is formed to make the heat sink(130) possible to be attached on both side surfaces in width direction. The printed circuit board is a single layer having a pattern on only a front surface thereof. A driving circuit(125) drives a power switching element(121) and a protection circuit(123). An IC chip is used as the power switching element. The chip-type power switching element(121) is bonded by the wire(101) and the pattern of the printed circuit board(120) to be interposed between the output terminals(113) and the driving circuit(125).
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