发明名称 THIN FILM DEPOSITION SYSTEM
摘要 PROBLEM TO BE SOLVED: To provide a laminated film deposition system occupying a small space in a high throughput by optimizing treating time in each treating chamber and the transfer of a robbot. SOLUTION: In this thin film deposition system continuously depositing laminated films on substrates, two sputter chambers having plural targets and two load lock chambers having substrate heating treating parts and substrate cooling treating parts movable in the vertical direction are connected to the circumference of a substrate transferring chamber arranged with a robbot having two substrate clamping hands performing the transfer of the substrates between the sputter chamber and the load lock chamber. Further, preferably, at least two of the side faces of the sputter chamber are fitted with the targets, and the bottom face is provided with a substrate holder rotatable in the horizontal direction, further rotating in the vertical direction and also holdable at an optional angle between the horizontal state and the vertical state. Moreover, it is possible that the substrate heating treating part in the load lock chamber is removed, and instead, a substrate heating chamber is separately provided.
申请公布号 JP2002020868(A) 申请公布日期 2002.01.23
申请号 JP20000202837 申请日期 2000.07.04
申请人 ANELVA CORP 发明人 AONUMA DAISUKE
分类号 C23C14/56;H01L21/203;H01L21/285;H01L21/677;H01L21/68;(IPC1-7):C23C14/56 主分类号 C23C14/56
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