| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a press-molded film putting the low moisture absorbing properties, dimensional stability, fire retardancy and high frequency characteristics of a thermoplastic resin to practical use and suitably used as an insulating base material excellent in processability as a circuit board such as excellent thermal dimensional stability, solder heat resistance, flatness, heat fusion processability, through-hole processability or the like, and to provide the press-molded film. SOLUTION: In a manufacturing process using a film comprising a thermoplastic resin film such as a polyphenylene sulfide resin or the like and shaping the same by press molding, the thermoplastic resin film is pressed for 5 min - 1 hr in a mold heater to temperature from the melting point Tm of the thermoplastic resin film to 100 deg.C to apply thermal transfer to the thermoplastic resin film. After the mold is cooled to the glass transition temperature Tg of the thermoplastic resin film for 10 min-5 hr, the molded film is released from the mold to form a circuit on the surface of the film.
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