发明名称 MATERIAL SUPPLY DEVICE OF TRANSFER MOLDING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a material supply device of a transfer molding device which is free from such a trouble that a resin material to be supplied is left over in a material hopper of the material supply device, when the granular resin material is supplied. SOLUTION: This material supply device of the transfer molding device is characterized in that it is equipped with a stirring member 20 having its rear end part 34 fixed to the upper area of a base plate 27 and its tip part 36 which protrudes at a position in close proximity to the bottom part 35 of a material hopper 21, when the upper end 32 of the hopper 21 is housed into an opening 33 of the base plate 27, as the stirring member 20 which stirs a granular resin material 2 in the material hopper 21, when the material hopper 21 holding the granular resin material 2 at the position where the upper end 32 of the hopper 21 is housed into the opening 33 of the base plate 27, is lowered by a lift.
申请公布号 JP2002067086(A) 申请公布日期 2002.03.05
申请号 JP20000262312 申请日期 2000.08.31
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 NISHIDE YASUTAKA
分类号 B29C45/18;B29C45/02;B29C45/14;H01L21/56;(IPC1-7):B29C45/18 主分类号 B29C45/18
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