| 摘要 |
PURPOSE: Provided are a copper electroplating material which is fed as a copper ion supply to a copper plating bath in which an object to be plated is subjected to copper electroplating, a method for producing such a copper electroplating material, and a copper plating method using such a copper electroplating material. CONSTITUTION: Basic copper carbonate is formed in a reaction tank by deposition and heated to a temperature of 250-800deg.C. and preferably between 350 deg.C. and 600 deg.C. in an atmosphere which does not form a reducing atmosphere, to thereby be subjected to thermal decomposition, resulting in providing easily soluble copper oxide. The copper oxide is washed with water and dewatered using, for example, a centrifugal separator. Then, the copper oxide is dried.
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