| 摘要 |
The present invention relates to a multiple-chip module comprising a package cavity (6) and a lead frame (26). The multiple-chip module has said lead frame (26) divided into die pad multiple islands (23, 24) and each of said die pad multiple islands (23; 24) is placed at different values of depression with respect to the plane (5) of said lead frame (26), so as to guarantee a perfect balanced resin's flow (27) in each part of said package cavity (6). <IMAGE> |
