| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce a manufacturing cost without producing peeling from the board 12 of a semiconductor chip 16. SOLUTION: The semiconductor chip 16 is bonded on the wiring pattern 24 of the board 12, and seals the semiconductor chip 16 by a mold resin 18. Since an interval A between the wiring patterns 24 in the neighborhood of the outer shape line of the semiconductor chip 16 is set 0.175 mm or less, no care of leakage of the mold resin 18 from between the wiring patters 24 under the semiconductor chip 16 exists. The condition of 0.175 mm or less is found by an inventor in an experiment as one that the mold resin 18 does not leak.</p> |
