发明名称 METHOD FOR FORMING PRINTED FILM OF ELECTRONIC MATERIAL
摘要 PROBLEM TO BE SOLVED: To suppress the bleeding and sagging of a printed film of ink of an electronic material in the lateral direction when the ink is injected into a part obtained by partially removing a resist film on a substrate to form the printed film and to enhance the pattern precision of a resistor or the like by the ink. SOLUTION: In the method for forming a printed film of an electronic material, a resist is applied on a substrate 1 to form a resist film 2, the required part of the resist film 2 is removed, ink 4 of the electronic material is injected into the part freed of the resist film 2 to form a printed film, the injected ink 4 is cured and the resist film 2 is optionally removed.
申请公布号 JP2002091019(A) 申请公布日期 2002.03.27
申请号 JP20000274946 申请日期 2000.09.11
申请人 MITSUBISHI ELECTRIC CORP 发明人 UZAKI SHUNSUKE
分类号 B41J2/335;B41M1/12;B41M1/34;G03F7/40;G03F7/42;H05K1/16;H05K3/10;H05K3/12;(IPC1-7):G03F7/40 主分类号 B41J2/335
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